The intended application of the syntactic foam is dictated by the amount of the microspheres added to the resin system. Mix equal parts by volume of microspheres with an epoxy resin system and obtain a pourable, self leveling syntactic foam that offers reduced weight per unit volume, suitable for casting parts with improve dimensional stability or as a low density adhesive used in maximizing reduction of structural weight with little effect of the adhesion quality.
Higher loading of the microsphere will yield a paste-like consistency suitable as a fairing compound with excellent stability in its Coefficient of Thermal Expansion or CTE. Adding a small amount of precipitated fumed silica, also known as Cab-O-Sil or Wacker will create a none-sagging or thixotropic compound that can be applied on vertical or overhead surfaces without flowing. Thixotropic syntactic foams can also be s brush or trowel applied coating with improved chemical and abrasion resistance.
When mixed with an epoxy based potting or encapsulating resin used in an electronic application, the addition of the microspheres dramatically improves dielectric constants, volume resistivity or electrical insulative values as well as its cured chemical resistant properties.
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